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Novel 1,2,3-triazole-based compounds: Iodo effect on their gelation behavior and cation response
Yaodong Huang, Shuxue Liu, Zhuofeng Xie, Zipei Sun, Wei Chai, Wei Jiang
《化学科学与工程前沿(英文)》 2018年 第12卷 第2期 页码 252-261 doi: 10.1007/s11705-017-1683-6
关键词: organogelator 1 2 3-triazole derivatives self-assembly halogen bonding cation response
《化学科学与工程前沿(英文)》 2023年 第17卷 第12期 页码 1879-1894 doi: 10.1007/s11705-023-2354-4
关键词: carbon dioxide halogen-free catalysis cyclic carbonate mechanistic insight
Kinetics of halogen-exchange fluorination of 2,6-dichlorobenzaldehyde
LIANG Zhengyong, LI Bindong, FENG Chao
《化学科学与工程前沿(英文)》 2008年 第2卷 第1期 页码 59-62 doi: 10.1007/s11705-008-0008-1
关键词: reaction solvent transfer catalysis activation nitrobenzene
The electrostatic-alloy bonding technique used in MEMS
WANG Wei, CHEN Wei-ping
《机械工程前沿(英文)》 2006年 第1卷 第2期 页码 238-241 doi: 10.1007/s11465-006-0011-5
关键词: Si/Au-glass strength MEMS packaging process sandwich structure
Ultraviolet exposure enhanced silicon direct bonding
Guanglan LIAO, Xuekun ZHANG, Xiaohui LIN, Canghai MA, Lei NIE, Tielin SHI,
《机械工程前沿(英文)》 2010年 第5卷 第1期 页码 87-92 doi: 10.1007/s11465-009-0078-x
关键词: ultraviolet (UV) exposure silicon direct bonding bonding strength reliability
Patterned wafer bonding using ultraviolet adhesive
Rui ZHUO, Guanglan LIAO, Wenliang LIU, Lei NIE, Tielin SHI
《机械工程前沿(英文)》 2011年 第6卷 第2期 页码 214-218 doi: 10.1007/s11465-011-0130-5
The process of patterned wafer bonding using ultraviolet (UV) adhesive as the intermediate layer was studied. By presetting the UV adhesive guide-layer, controlling the thickness of the intermediate layer (1– 1.5 μm), appropriate pre-drying temperature (60°C), and predrying time (6 min), we obtained the intermediate layer bonding of patterned quartz/quartz. Experimental results indicate that patterned wafer bonding using UV adhesive is achieved under room temperature. The process also has advantages of easy operation, low cost, and no plugging or leakage in the patterned area after bonding. Using the process, a microfluidic chip for red blood cell counting was designed and fabricated. Patterned wafer bonding using UV adhesive will have great potential in the fabrication of microfluidic chips.
关键词: ultraviolet (UV) adhesive intermediate layer patterned wafer bonding
A space solar cell bonding robot
FU Zhuang, ZHAO Yan-zheng, LIU Ren-qiang, DONG Zhi
《机械工程前沿(英文)》 2006年 第1卷 第3期 页码 360-363 doi: 10.1007/s11465-006-0027-x
关键词: Cartesian coordinate thickness three-axis Cartesian orientation control subsystem
时君友,徐文彪,王淑敏
《中国工程科学》 2014年 第16卷 第4期 页码 40-44
以淀粉基水性高分子异氰酸酯(API)胶合木胶接结构为研究对象,以胶接的压缩剪切强度为评估指标,通过加速湿热老化试验对胶接结构的破坏模式和失效机理进行了研究。结果表明:胶接结构的断裂性质为韧性断裂,且随着老化时间的增加,其破坏模式为由内聚破坏向内聚破坏+界面破坏转变。在湿热老化试验前期温度对压缩剪切试样性能起主要作用,在老化后期湿度起主要作用。
Shoshan T. Abrahami, John M. M. de Kok, Herman Terryn, Johannes M. C. Mol
《化学科学与工程前沿(英文)》 2017年 第11卷 第3期 页码 465-482 doi: 10.1007/s11705-017-1641-3
关键词: aluminum Cr(VI)-free surface pre-treatments anodizing adhesive bonding
ARC welding method for bonding steel with aluminum
Zhenyang LU, Pengfei HUANG, Wenning GAO, Yan LI, Hanpeng ZHANG, Shuyan YIN
《机械工程前沿(英文)》 2009年 第4卷 第2期 页码 134-146 doi: 10.1007/s11465-009-0033-x
关键词: joining of steel and aluminum low energy input welding arc welding fusion welding – brazing
王渭源,王跃林
《中国工程科学》 2002年 第4卷 第6期 页码 56-62
对静电键合、体硅直接键合和界面层辅助键合等三种体硅键合技术,整片操作、局部操作和选择保护等三种密封技术,以及这些技术用于微电子机械系统的密封作了评述,强调在器件研究开始时应考虑封装问题,具体技术则应在保证器件功能和尽量减少芯片复杂性两者之间权衡决定。
关键词: 体硅键合技术 薄膜密封技术 微电子机械系统封装技术
《化学科学与工程前沿(英文)》 2023年 第17卷 第10期 页码 1568-1580 doi: 10.1007/s11705-023-2303-2
关键词: magnetic polymer chromium removal hydrogen bonding recyclability actual wastewater
Whole pictures of halogenated disinfection byproducts in tap water from China’s cities
Yang PAN,Xiangru ZHANG,Jianping ZHAI
《环境科学与工程前沿(英文)》 2015年 第9卷 第1期 页码 121-130 doi: 10.1007/s11783-014-0727-0
关键词: Disinfection byproducts (DBPs) total organic halogen tap water in China
《结构与土木工程前沿(英文)》 2021年 第15卷 第4期 页码 895-904 doi: 10.1007/s11709-021-0759-z
关键词: steel bridge deck pavement ultra-high-performance concrete epoxy resin composite structure bending fatigue performance
Thermal transport properties of monolayer phosphorene: a mini-review of theoretical studies
Guangzhao QIN, Ming HU
《能源前沿(英文)》 2018年 第12卷 第1期 页码 87-96 doi: 10.1007/s11708-018-0513-y
标题 作者 时间 类型 操作
Novel 1,2,3-triazole-based compounds: Iodo effect on their gelation behavior and cation response
Yaodong Huang, Shuxue Liu, Zhuofeng Xie, Zipei Sun, Wei Chai, Wei Jiang
期刊论文
Recent advances in cycloaddition of CO with epoxides: halogen-free catalysis and mechanistic insights
期刊论文
Kinetics of halogen-exchange fluorination of 2,6-dichlorobenzaldehyde
LIANG Zhengyong, LI Bindong, FENG Chao
期刊论文
Ultraviolet exposure enhanced silicon direct bonding
Guanglan LIAO, Xuekun ZHANG, Xiaohui LIN, Canghai MA, Lei NIE, Tielin SHI,
期刊论文
Patterned wafer bonding using ultraviolet adhesive
Rui ZHUO, Guanglan LIAO, Wenliang LIU, Lei NIE, Tielin SHI
期刊论文
Towards Cr(VI)-free anodization of aluminum alloys for aerospace adhesive bonding applications: A review
Shoshan T. Abrahami, John M. M. de Kok, Herman Terryn, Johannes M. C. Mol
期刊论文
ARC welding method for bonding steel with aluminum
Zhenyang LU, Pengfei HUANG, Wenning GAO, Yan LI, Hanpeng ZHANG, Shuyan YIN
期刊论文
Hyperbranched magnetic polymer: highly efficient removal of Cr(VI) and application in electroplating wastewater
期刊论文
Whole pictures of halogenated disinfection byproducts in tap water from China’s cities
Yang PAN,Xiangru ZHANG,Jianping ZHAI
期刊论文
Performance of steel bridge deck pavement structure with ultra high performance concrete based on resin bonding
期刊论文